IQM is a global leader in designing, building, and selling superconducting quantum computers. IQM provides both on-premises full-stack quantum computers and a cloud platform to access its computers anywhere in the world. IQM customers include the leading high-performance computing centres, research labs, universities and enterprises which have full access to IQM's software and hardware.  IQM has over 280 employees with offices in Finland, Germany, France, Spain, Poland, Singapore and the US. 

(www.meetiqm.com)

We are looking for a Micro-Packaging Summer Trainee to join our Chip Production Team in Espoo for the summer! This is a fantastic opportunity to gain hands-on experience in high-precision assembly and work with industry experts.

What will I be doing?

• Operating wire-bonding machines for chip assembly
• Working alongside experienced Micro-Packaging Specialists and Engineers to troubleshoot and optimize processes
• Conducting quality control checks to ensure high-reliability chip production
• Handling assembly, inspection, preparation, and other micro-packaging tasks

What skills do I need?

• Strong technical communication skills to collaborate effectively
• Good hands-on skills with attention to precision
• An eye for detail to ensure high-quality standards
• Basic understanding of mechanical parts and their functions
• Familiarity with electronic components and their applications

What can I expect from IQM?

• An opportunity to work with a passionate and diverse team on an important mission
• A unique opportunity to make a real impact on the future of quantum
• Growth and progress in a creative and open start-up environment

Meet our people and hear more about IQM by visiting our Youtube channel here >>

We'll proceed with the interviews immediately, so please submit your application soon.

Please note that only applications submitted through the website will be processed.