IQM is the European leader in superconducting quantum computers, established in Espoo, Finland. Since 2019, we have grown to 270+ employees and have established  subsidiaries in Germany, Spain, France, the US and Singapore. We build quantum computers for research laboratories and supercomputing centers. For industrial customers, we deliver quantum advantage through our unique application-specific co-design approach.

We build world-leading quantum computers for the well-being of humankind now and for the future.

(www.meetiqm.com)

We are now looking for a Micro-packaging summer trainee to strengthen our team! In this role, you will participate in building parts to Quantum Computer together with the Chip Production team in IQM Premises. To succeed in the role, we are looking for a person with hands-on skills in micro-packaging, micro-mechanics, electronics or in other relevant area.

 What will I be doing?

• Chip Production related to Quantum computer components
• Micro-packaging production processes of quantum chips, ensuring the QPUs and test chips are packaged with consistent quality and in timely manner.

What skills do I need?

• Systematic approach to work and willingness to learn more
• Hands-on experience of micro-mechanics and components handling
• Communication skills in English
• Effective communication and interpersonal skills.

What can I expect from IQM?

• A great opportunity to perform world-class R&D and implement cutting edge technology
• Cutting-edge manufacturing and laboratory infrastructure
• Sufficient financial backing for ambitious projects
• An opportunity to work with a passionate and diverse team on an important mission
• A unique opportunity to make a real impact on the future of quantum
• Growth and progress in a creative and open start-up environment

Meet our people and hear more about IQM by visiting our Youtube channel here >>

We'll proceed with the interviews immediately, so please submit your application soon.